主要成分：FIG.2 illustrates a cross sectional view of packaged IC 10 of FIG.1
——圖2說明了圖1封裝集成電路 10的截面視圖
后置定語：taken through some of solder pads 16 (such as exemplary solder ball pads 24 and 26) and large inner solder pads 20 and 21
——通過一些焊料隆起焊盤（諸如焊球焊盤24和26）和大的內(nèi)部焊料隆起焊盤得到的[截面視圖] 【可以改寫為定語從句 which is taken through …】
參考譯文：圖2說明了通過一些焊料隆起焊盤（諸如焊球焊盤24和26）和大的內(nèi)部焊料隆起焊盤得到的圖1封裝集成電路 10的截面視圖.
英語翻譯
英語翻譯
FIG.2 illustrates a cross sectional view ofpackaged IC 10 of FIG.1 taken through some of solder pads 16 (such as exemplary solder ball pads 24 and 26) and largeinner solder pads 20 and 21
FIG.2 illustrates a cross sectional view ofpackaged IC 10 of FIG.1 taken through some of solder pads 16 (such as exemplary solder ball pads 24 and 26) and largeinner solder pads 20 and 21
英語人氣：469 ℃時(shí)間：2020-04-03 08:10:19
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